FB2-300X600D Fotomechanix FB2-300X600D, Double Sided Photoresist Board FR4 35μm Copper Thick, 600 x 300 x 1.6mm
Description
FB2-300X600D, Double Sided Photoresist Board FR4 35μm Copper Thick, 600 x 300 x 1.6mm
The product with part number FB2-300X600D (FB2-300X600D, Double Sided Photoresist Board FR4 35μm Copper Thick, 600 x 300 x 1.6mm)
is from company Fotomechanix and distributed with basic unit price 57,60 EUR. Minimal order quantity is 1 pc.
Base MaterialEpoxy Glass Fabric Laminate Copper Thickness35µm Dimensions600 x 300 x 1.6mm FR Material GradeFR4 Length600mm Number of Sides2 Thickness1.6mm Width300mm Product Details FR4 Eurocard & Other Sizes FR4 substrates for normal applicationsBoard thickness 1.6 mmCopper thickness 35 μm Type Fotoboard FR4 Base Material Epoxy glass fabric laminate Foil Laminate High purity electro-deposited copper Dielectric Constant. 4.7 @ 1MHz Dissipation Factor 0.019 @ 1MHz Surface Resistance 4 x 1012Ω Volume Resistance 2 x 1015Ω cm Water Absorption >0.01% Solderbath Resistance Note Developer concentration: 25g/l of 690-849 or 6-10g/l of Sodium or Potassium Hydroxide. Conduct trials if in doubt. Approvals UL, CSA (K130 and above) Photoresists & Copper-Clad Boards Printed circuit board materials for the manufacture of high quality PCBsStandard high quality glass-epoxy FR4 substrate and glass-APPE substrate specifically for high frequency applicationsWhere applicable, the resist coated boards are exposed using UV light before being developed with half-strength Universal Developer solution and finally etched using a solution of Ferric Chloride Hexahydrate Crystals. Pre-sensitised with positive working photoresist, protected by a black plastic peel-off film Photoresists/Pre-sensitised Boards
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